HDSC华大半导体有限公司（简称华大半导体）是中国电子信息产业集团有限公司（CEC）整合旗下集成电路企业而组建的专业子集团。旗下有三家上市公司，总资产规模超过100亿。2014年5月8日在上海成立，专业从事集成电路设计及相关解决方案。2016年位列国内集成电路设计企业第四名，在智能卡及安全芯片、智能卡应用、模拟电路、新型显示等领域占有较大的份额。

HDSC华大半导体主要产品种类包括：工控MCU、功率及驱动芯片、智能卡及安全芯片、电源管理芯片、新型显示芯片。
     
HDSC华大半导体产业空间布局以上海为中心，形成三大产业基地：华东智能制造产业基地（上海）、华北安全芯片产业基地（北京）、香港显示产业基地；并设立美国、英国、日本、韩国等海外研发中心。

面向“十三五”，HDSC华大半导体大力推动工业控制（含汽车电子）、安全物联网、新型显示等产品研发及应用，不断提升竞争能力，以产业发展带动中国集成电路优化升级，着力打造世界一流的集成电路产业集团。

Founded in Shanghai on May 8th 2014, HDSC (HUADA Semiconductor Co., Ltd.) is a platform forged by CEC by integrating its subsidiary semiconductor companies with the purpose of creating a semiconductor group company with global competitiveness. HDSC (HUADA Semiconductor Co., Ltd.), one of the top ten IC design companies in China, focuses on IC design and relevant solution development, occupies leading marketshare in analog circuit, LCD driver, SmartCard and security chips and is ranked No. 1 in China, top 5 globally, regarding the shipment volume and revenue of SmartCard and security chips.    

Focusing on the development of industrial、Security of IOT and display products. Serving for Made in China2025 strategy, Supporting the first important display project of CEC, Driving the transition to high-endintegrated circuit products to achieve IC self-manufacture independently.